1.2W Thermal Pad Silicone Laptop High Cooling Thermal Heating Pads for Chipset Battery Factory Thermal Pad Die Cuts
The TIF100-12-05ES series thermally conductive interface materials are gap fillers reinforced one side with kepton; the other side with adhesive.They are applied to fill the air gaps between the heating elements and the heatdissipation fins or the metal base.Their flexibility and viscoelastic feature make them ideal to coat very uneven surfaces. lts smooth, puncture-,tear-, wear-resistant reinforcement surface is perfect for reworking and plug-in devices.
Features:
> Good thermal conductive: 1.2 W/mK
> Naturally tacky needing no further
> Soft and Compressible for low stress applications
> Available in varies thickness
Applications:
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
| Typical Properties of TIF100-12-05ES Series |
| Color |
Blue |
Visual |
| Construction &Compostion |
Ceramic filled silicone rubber |
*** |
| Thickness |
0.020"(0.5mm)~0.200"(5.0MM) |
ASTM D374 |
| Specific Gravity |
2.0g/cc |
ASTM D792 |
| Hardness |
12±5 Shore 00 |
ASTM 2240 |
| Continuos Use Temp |
-40 to 160℃ |
*** |
| Dielectric Breakdown Voltage |
>5500 VAC |
ASTM D149 |
| Dielectric Constant |
4.5 MHz |
ASTM D150 |
| Volume Resistivity |
1.0X10¹² Ohm-meter |
ASTM D257 |
| Fire rating |
94 V0 |
UL E331100 |
| Thermal conductivity |
1.2 W/m-K |
ASTM D5470 |
Standard Thicknesses:
0.010" (0.25mm),0.020" (0.51mm),0.030" (0.76mm),0.040" (1.02mm),0.050" (1.27mm),
0.060" (1.52mm),0.070" (1.78mm),0.080" (2.03mm),0.090" (2.29mm),0.100" (2.54mm),
0.110" (2.79mm),0.120" (3.05mm),0.130" (3.30mm),0.140" (3.56mm),0.150" (3.81mm),
0.160" (4.06mm),0.170" (4.32mm),0.180" (4.57mm),0.190" (4.83mm),0.200" (5.08mm)
Consult the factory alternate thickness.
Standard Sheets Sizes:
8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied.
Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.
Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company profile
Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
