Product Description

Thermal Conductive Adhesive Tape for LED Light Chip PCB Strip

The TIA™800 Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing.

 

Features
> Thermal Conductivity: 0.8W/mK

> High performance,thermally conductive acrylic adhesive.

> Hihg bond strength to a variety of surfaces double sided pressure sensitive adhesive tape

Applications

> Mount heat sink onto BGA graphic processor or drive processor
> Mount heat spreader onto power converter PCB or onto motor control PCB
> High performance, thermally conductive acrylic adhesive
> Can be used instead of heat cure adhesive,screw mounting or clip mounting

Typical Properties of TIA™800 Series
Product Name	TIATM802	TIATM804	TIATM806	TIATM808	TIATM810	TIATM812	TIATM815	Test Method
Color	White							Visual
Adhesive Type	Acrylic Adhesive							********
Backing Type	N/A							********
Continuous Use Temp	-45℃ to 120℃							********
Composite Thickness	0.0019" 0.05mm	0.004" 0.101mm	0.006" 0.152mm	0.008" 0.203mm	0.010" 0.254mm	0.012" 0.304mm	0.015" 0.381mm	ASTM D374
Voltage Breakdown	> 600Vac	> 1200Vac	> 1800 Vac	>2500 Vac	> 2700 Vac	> 3000 Vac	> 4000 Vac	ASTM D149
180 Peel Adhesion	>1200 g/inch (Steel, Immediate)							PSTC-1
180 Peel Adhesion	>1400 g/inch (Steel after 24hrs)							PSTC-1
Holding Power 25℃/Hours	> 48 Hours							PSTC-7
Holding Power 80℃/Hours	> 48 Hours							PSTC-7
Thermal Conductivity	0.8W/mK							ASTM D5470

Standard Thicknesses:
0.0019"(0.05mm), 0.004"(0.101mm) , 0.006" (0.152mm), 0.008" (0.203mm), 0.010"(0.254mm), 

0.012"(0.304mm), 0.015" (0.381mm)
Consult the factory alternate thickness.

Standard Sizes:
16" x 100"(406mm x 30.48mm) 
Individual die cut shapes can be supplied.

Reinforcement:

TIA800 series rolls type can add with fiberglass reinforced.

Company Profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

Payment Terms︰ T/T in advance

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