Product Description

1.2W Thermal Pad Silicone Laptop High Cooling Thermal Heating Pads for Chipset Battery Factory Thermal Pad Die Cuts
 
The TIF100-12-05ES series thermally conductive interface materials are gap fillers reinforced one side with kepton; the other side with adhesive.They are applied to fill the air gaps between the heating elements and the heatdissipation fins or the metal base.Their flexibility and viscoelastic feature make them ideal to coat very uneven surfaces. lts smooth, puncture-,tear-, wear-resistant reinforcement surface is perfect for reworking and plug-in devices.

Features:
>  Good thermal conductive: 1.2 W/mK 
>  Naturally tacky needing no further
>  Soft and Compressible for low stress applications
>  Available in varies thickness

Applications:
>  CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices

Typical Properties of TIF100-12-05ES Series
Color	Blue	Visual
Construction &Compostion	Ceramic filled silicone rubber	***
Thickness	0.020"(0.5mm)~0.200"(5.0MM)	ASTM D374
Specific Gravity	2.0g/cc	ASTM D792
Hardness	12±5 Shore 00	ASTM 2240
Continuos Use Temp	-40 to 160℃	***
Dielectric Breakdown Voltage	>5500 VAC	ASTM D149
Dielectric Constant	4.5 MHz	ASTM D150
Volume Resistivity	1.0X10¹² Ohm-meter	ASTM D257
Fire rating	94 V0	UL E331100
Thermal conductivity	1.2 W/m-K	ASTM D5470

 Standard Thicknesses:           

0.010" (0.25mm),0.020" (0.51mm),0.030" (0.76mm),0.040" (1.02mm),0.050" (1.27mm),

0.060" (1.52mm),0.070" (1.78mm),0.080" (2.03mm),0.090" (2.29mm),0.100" (2.54mm),

0.110" (2.79mm),0.120" (3.05mm),0.130" (3.30mm),0.140" (3.56mm),0.150" (3.81mm),

0.160" (4.06mm),0.170" (4.32mm),0.180" (4.57mm),0.190" (4.83mm),0.200" (5.08mm)
Consult the factory alternate thickness.

Standard Sheets Sizes:         
8" x 16"(203mm x 406mm)   16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied. 

Peressure Sensitive Adhesive:                     
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:                     
TIF™ series sheets type can add with fiberglass reinforced.

 

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company profile

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

 

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer
6.Quality assurance contract

Payment Terms︰ T/T in advance

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